发明名称 FLEXIBLE PRINTED WIRING BOARD AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which is high in characteristic impedance. SOLUTION: The flexible laminate 11 of a flexible parallel wiring 10 is composed of a base film 11a, a conductor circuit 11b formed on the one side of the base film 11a, and a first cover film 11c laminated on the base film 11a. An adhesive layer 12 is formed on the other side of the base film 11a. A second cover film 13 is laminated on the adhesive layer 12. The first cover film 11e is composed of a polyimide resin film 11d and an adhesive layer 11e applied on the one side of the resin film 11d. The second cover film 13 is composed of a polyimide resin film 13a and an adhesive layer 13b applied on the one side of the resin film 13a. Copper wires 14 30μm or so in diameter are laid at an interval of 300μm or so between the flexible laminate 11 and the second cover film 13.
申请公布号 JPH11121882(A) 申请公布日期 1999.04.30
申请号 JP19970296321 申请日期 1997.10.14
申请人 SUMITOMO BAKELITE CO LTD 发明人 KATO RYOJI;KUMAGAI TAKAYOSHI
分类号 H05K1/02;H05K1/00;H05K1/14;H05K3/10;H05K3/28;H05K3/36;H05K3/46;(IPC1-7):H05K1/02 主分类号 H05K1/02
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