| 摘要 |
PROBLEM TO BE SOLVED: To efficiently radiate heat from a semiconductor chip, without increase in cost. SOLUTION: This device comprises a package board 2 having a ground plate 10 as an inner conductive layer, a semiconductor base 3 which is mounted faceup on the surface of the board 2 and sealed with a patting resin 9, and solder bumps 4 formed on the back side of the board 2, including thermal bumps 4b for removing the heat generated from the base 3 to a mounting circuit board, through thermal through-holes 13 connected to the ground plane 10 through an inner layer of the board 2, thus removing part of the heat generated from the base 3 to the circuit board via the plane 10, through-holes 12 and input/ output bumps 4a. |
