| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin encapsulated-type semiconductor device the package size of which is reduced and the resin encapsulating ability of which is superior. SOLUTION: In a semiconductor device, a lead having a main face, a back face which faces the main face and an electrode formed on the main face and a lead which is connected electrically to the electrode are provided, and the lead is led out from one side of a package sealing the semiconductor chip to an outer part. An insulating member 11 is laid between a lead 13 and the back of a semiconductor chip 12, so that the lead supports the semiconductor chip 12. The semiconductor chip 12 is mounted on the lead 13 via an insulating member 11. One end of the lead 13 is electrically connected to the electrode, arranged along a side opposite to the side of the semiconductor chip 12 which is close to one side of the package. A lead part between one end of the lead 13 and the lead part which is led out to the outer part extends to one side of the package on the insulating material 11.</p> |
