| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method which is capable of manufacturing a TAB tape for BGA, in which the formation of via holes for an insulating film can be made uniform without deformations, disconnection is not generated in the parts of solder balls when stress which is to be caused by thermal elongation is applied, and reliability is high. SOLUTION: A laminate 4 is constituted of a copper foil 1 as a first metal layer, a polyimide film 2 which has the copper foil 1 on the first surface by casting to the copper foil 1, and an adhesive agent layer 3 formed on the second surface of the polyimide film 2. After via holes 5 and a device hole 6 are formed by punching work on the laminated member 4, a copper foil 7 is stuck on the adhesive agent layer 3, and parts from at least the inner wall surfaces of the via holes 5 to the peripheries are covered with a copper plating 8. The copper plating 8 has a thickness corresponding to the temperature and the time of soldering of solder balls 14. The thickness is set in a range of 7-10μm, when the solder balls 14 are formed at a condition of 245 deg.C×60 sec.
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