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发明名称
HEAT TREATMENT DEVICE FOR SEMICONDUCTOR WAFER AND METHOD OF HEAT TREATING SEMICONDUCTOR WAFER
摘要
申请公布号
JPH11121391(A)
申请公布日期
1999.04.30
申请号
JP19970279032
申请日期
1997.10.13
申请人
TOSHIBA CORP
发明人
OGINO HIROSHI
分类号
H01L21/22;H01L21/26;H01L21/31;H01L21/324;(IPC1-7):H01L21/26
主分类号
H01L21/22
代理机构
代理人
主权项
地址
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