Forming coolant stream for wafer processing during cutting with saw

摘要

To a part-stream (B) of the used ultra-pure water is added a substance (F) increasing conductivity for forming the electrolyte (C) during the later evaporation. The substance leaves no residue on the processed wafer. The formed electrolyte is mixed to the main stream (A) dependent upon a preset conductivity value for the coolant stream (D). The compression chamber, to which the part-stream is fed, is kept under adjustable saturation pressure and a gas, dissociating under pressure is introduced into the chamber. After adding the electrolyte the coolant stream is mixed.