Process for placing number of solder-material shaped pieces on connecting surface arrangement of substrate and for melting them onto surfaces

摘要

Placing a number of solder material shaped pieces on a connecting surface arrangement of a substrate and for melting the shaped pieces onto the surfaces comprises arranging a template device (21) with a number of openings (27) and subjecting the pieces arranged in the openings to a laser device. Placing a number of solder material shaped pieces on a connecting surface arrangement of a substrate having a number of connecting surfaces and for melting the shaped pieces onto the surfaces comprises: (i) arranging a template device (21) with a number of template openings (27) to accommodate solder-material shaped pieces relative to a substrate provided with a connecting surface arrangement so that the shaped pieces are assigned to the individual connecting surfaces; and (ii) subjecting the solder-material shaped pieces accommodated in the template openings to a laser device (39) located to the rear of the template device so that the shaped pieces are treated to laser energy through the template device.