| 摘要 |
A frequency matched signal conduit apparatus wherein a micro-strip feed fabricated onto a material consistent with long vacuum life applications, such as ceramic or other crystalline materials, is used with a vacuum vessel signal interconnect, electrically connected to the micro-strip feed, comprising thermally resistive, electrically conductive material that provides high thermal isolation and low signal loss, for electrically connecting the micro-strip feed network to a device to be cooled. |
