| 摘要 |
<p>The invention relates to a coaxial conductor comprising an inner conductor IS), an outer conductor (U) encasing the inner conductor (S) at least partly, and a dielectric (E) placed between the same. The coaxial conductor (K) is formed in a multi-layer circuit board (M) primarily by means of vias (2a-2h) and strip conductors (1a-1i). According to an embodiment of the coaxial conductor of the invention, the inner conductor IS) is formed substantially parallel to the board layers (3a-3e) of the multi-layer circuit board (M), the inner conductor (S) is formed of at least one strip conductor (la, 1b) or at least one electroconductive via (2a) or a combination of the same, and the outer conductor (U) is formed of at least four electroconductive vias (2b-2h) and at least two strip conductors (1c-1i). The dielectric (E) is at least partly formed of the material of the board layers (3a-3e). The invention relates also to a method for manufacturing a coaxial conductor. The invention relates further to a wireless communication device comprising at least one multi-layer circuit board (M) and at least one coaxial conductor. <IMAGE></p> |
