发明名称 Instrument panel cover arrangement and method of making
摘要 <p>An instrument panel cover arrangement is used for covering an air bag module 60 mounted beneath an instrument panel cover 20 in a vehicle 9. The arrangement includes a rigid substrate 21 forming the instrument panel cover 20 and a cover plate 40 overlying the substrate 21 in the location of the underlying air bag module 60 and securely attached to the substrate 21. The cover plate 40 includes outer plate edges 42, 48, 49. The substrate 21 includes a plurality of cut lines 31, 32, 33 generally defining an air bag deployment opening 30 and extending entirely through the substrate 21. The cut lines 31, 32, 33 are at a location spaced inwardly from the outer plate edges 42, 48, 49 of the cover plate 40 such that upon air bag deployment, the outer plate edges 42, 48, 49 are separated from the substrate 21 by the force of the deploying air bag 61. Preferably, the cut lines 31, 32, 33 extend entirely through the substrate 21 to define a major substrate portion 28 and a minor substrate portion 27. The minor substrate portion 27 entirely underlies and is securely attached to the cover plate 40 and is completely detached from the major substrate portion 28 prior to air bag deployment. <IMAGE></p>
申请公布号 EP0911225(A2) 申请公布日期 1999.04.28
申请号 EP19980203193 申请日期 1998.09.23
申请人 DELPHI TECHNOLOGIES, INC. 发明人 SOMMER, JAMES JOHN;VENDELY, MICHAEL JOSEPH
分类号 B60R21/2165;(IPC1-7):B60R21/20 主分类号 B60R21/2165
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