发明名称 |
Method of resistless gate metal etch for fets |
摘要 |
A method of resistless gate metal etch in the formation of a field effect transistor is disclosed, which includes providing a first layer of a first semiconductor material having a surface. A second layer of a second semiconductor material is formed on the surface and resistlessly patterned to define a masked and an unmasked portions. The unmasked portion of the second layer is etched away to the first layer to enable gate formation.
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申请公布号 |
US5897366(A) |
申请公布日期 |
1999.04.27 |
申请号 |
US19970813400 |
申请日期 |
1997.03.10 |
申请人 |
MOTOROLA, INC. |
发明人 |
SHIRALAGI, KUMAR;TEHRANI, SAIED N. |
分类号 |
H01L21/308;H01L21/335;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/308 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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