| 摘要 |
The wafer (18) is held in the cleaning chamber between the upper (12) and lower (14) blocks of the assembly. The blocks are made of quartz to resist the solvents and vibration damage. Various liquids are fed to the chamber and agitated by the high frequency sonic transducer (22). The liquids are pumped in and out via cylindrical channels. A variety of solvents and acids is used, with the wafer being rinsed with deionised water in-between each wash.
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