Structure for mounting electronic components and method for mounting the same

摘要

A semiconductor sensor chip such as an acceleration sensor chip and other electronic components such as controlling semiconductor chips are mounted on and connected to conductor patterns formed on a ceramic package. The ceramic package is heated together with a cap to hermetically seal the ceramic package containing the sensor chip and electronic components therein. The conductor pattern formed on the ceramic package is composed of a base film of, i.e., tungsten, an intermediate film of nickel plated on the base film and a thin surface film of gold which is formed on the intermediate film by flash plating. The conductor patterns are also formed at outside portions of the ceramic package. The ceramic package is mounted on a printed board by soldering at portions where the conductor patterns are formed. Though the surface gold film is thin and made at a low cost, it provides an excellent surface of the conductor patterns for securing a good solder wettability and bonding quality.