Direct chip attach for low alpha emission interconnect system
摘要
An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.
申请公布号
US5897336(A)
申请公布日期
1999.04.27
申请号
US19970864196
申请日期
1997.05.28
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
BROUILLETTE, GUY PAUL;DANOVITCH, DAVID HIRSCH;LIEHR, MICHAEL;MOTSIFF, WILLIAM THOMAS;ROLDAN, JUDITH MARIE;SAMBUCETTI, CARLOS JUAN;SARAF, RAVI F.