发明名称 |
Microelectronic packages and packaging methods including thermally and electrically conductive pad |
摘要 |
A thermally and electrically conductive (TEC) pad is disposed between a PCB and a heat sink in a cellular telephone base station. The TEC pad includes at least one aperture that overlies one or more signal vias on a ground plane of the PCB. The TEC pad apertures are larger than any underlying signal vias in order to electrically isolate the signal vias from the conductive material of the pad and the heat sink. The TEC pad allows ground vias on a PCB ground plane to ground to the heat sink.
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申请公布号 |
US5898573(A) |
申请公布日期 |
1999.04.27 |
申请号 |
US19970939394 |
申请日期 |
1997.09.29 |
申请人 |
ERICSSON INC. |
发明人 |
FUGARO, ANTHONY SALVATORE |
分类号 |
H05K1/02;H05K3/00;H05K3/42;H05K7/20;H05K9/00;(IPC1-7):H05K7/20;H01L23/34 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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