发明名称 COMPOSITE IC CARD AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To prevent a crack of an IC chip by forming a recess on an antenna card body having an antenna coil provided with a soft conductive base material layer embedded therein, and connecting a connecting terminal of an IC module of the recess to a connecting terminal of the coil via the base material layer formed at an end of the recess at the bottom side. SOLUTION: A card body 30 having an antenna coil board 10 for thickly placing soft conductive base material layers 15 of a conductive adhesive or the like on connecting terminals 12 of both front ends of an antenna coil 11 and covered on both surfaces with card base materials to be embedded is formed. And, recesses 14 for containing a spot facing IC module 20 are formed on the layers 15 of the body 30. And, connecting terminals 13 of the module 20 are connected to connecting terminals 12 of the coil 11 via the layers 15 at both ends of the bottoms of the recesses 14. As the layers 15, in addition to a conductive adhesive, conductive rubber, solder or the like is preferably used. And, as the card base material, an insulating synthetic resin is used.
申请公布号 JPH11115355(A) 申请公布日期 1999.04.27
申请号 JP19970280707 申请日期 1997.10.14
申请人 TOPPAN PRINTING CO LTD 发明人 ARAI YOSHIE;NOZAKI NAOTO;ARAI KAZUE
分类号 B42D15/10;G06K19/07;G06K19/077;H05K1/18;H05K3/32 主分类号 B42D15/10
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