| 摘要 |
PROBLEM TO BE SOLVED: To restrict the occurrence of dust on a substrate when centering it. SOLUTION: A wafer W is placed on a substrate holding member 8 formed on a board holding base 7. A pushing member 2 is moved to an arrow mark 13 and the wafer is lifted up at its edge by using the inclined face 2a of the pushing member 2. In this way, a roll 31 rolls to support the wafer W on its back to allow the movement of the wafer W to the arrow mark 13. When the pushing member 2 is further moved to the arrow mark 13, the edge of the wafer W is put in contact with the contact face 2b of the pushing member 2 to push the wafer W to the arrow mark 13. When the pushing member 2 is further moved to the arrow mark 13, the other edge of the wafer W is put in contact with the contact face 1a of a reference member 1 and the wafer W is held between the contact face 1a and the contact face 2b and aligned there to stop the movement of the pushing member 2. In this case, the roll 31 supporting the wafer W at its back rolls to extremely reduce the occurrence of dust. |
