| 摘要 |
An apparatus is provided for applying solder paste to the contact elements of ball grid array components, which is economical to manufacture and simple to handle, and which nonetheless offers the possibility of being able to apply a desired amount of solder precisely to the contact elements of a ball grid array component. The apparatus includes a rack on which a printing screen and an adjusting screen, each with a hole pattern corresponding to the pattern of the contact elements, are arranged one over the other in such a way that their hole patterns are aligned with one another, whereby the hole diameter or mesh size of the adjusting screen is greater than the diameter of the contact elements, a component mount intended for the mounting of the component, which mount is mounted on the rack, perpendicular to the screens, so as to be movable between a print position, in which the component lies at least approximately on the adjusting screen with contact elements that engage in the adjusting holes thereof, and a component exchange position, and has a mechanism for holding the component fast, and a doctor blade apparatus with a doctor blade that lies on the side of the printing screen turned away from the component and can be positioned parallel to this screen.
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