| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, on which electrodes of a semiconductor bare chip are relocated through the use of a converting substrate and which exhibits superior signal transmitting properties and can be manufactured with ease and at low cost by reducing the wiring length for the relocation and simplifying the structure of the device. SOLUTION: A semiconductor bare chip 10 is fixed and supported with its face upward in the recessed center of a converting substrate 16. Electrode pads 18 having sufficient area are disposed around the protuberant perimeter of the converting substrate 16. An electrode 20 for connection to the semiconductor bare chip and an electrode 22 in the form of a bump for connection to a circuit board are formed on each electrode pad 18. Electrodes 14 and the electrodes 20 for connection to the semiconductor bare chip are connected through metallic wires 24. In this way, the electrodes 14 on the electrode pads 12 of the semiconductor bare chip 10 are relocated to the electrodes 22, in the form of bumps for connection to the circuit board on the top of the converting substrate 16. |
