| 摘要 |
PROBLEM TO BE SOLVED: To reduce the thickness of an optical pick-up device and to miniaturize and make thin the device by burying a semifixed resistor for adjusting the laser power of an optical system in the thickness direction of a slide base. SOLUTION: A hole part 18 that is penetrated in a thickness direction is formed at a position away from the accommodation part of the optical system of a slide base 2, and a semifixed resistor 17 for adjusting the output of a semiconductor laser 8 is arranged while it is buried into the hole part 18. In this case, the upper surface side of the hole part 18 is covered with the extension part of a flexible printed wiring board 16 and the semifixed resistor 17 is fixed to an inner surface side part that opposes the hole part 18 of the flexible printed wiring board 16. Therefore, by inserting an adjustment tool from the lower surface side of the slide base 2 through the hole part 18 and rotating it, the semifixed resistor 17 can be adjusted. The adjustment is performed in a manufacturer's assembly process, thus adjusting the output of the semiconductor laser 8 to an optimum value. |
