CERAMIC BALL GRID ALLAY WITH REINFORCED FEATURE USING SOLDER EXTENSION ON GROUND BY CLIP

摘要

PROBLEM TO BE SOLVED: To provide a device for extending mutual connection and junction between two substrates in an electronic circuit module. SOLUTION: A device applies separating (extending) force to two substrates 16 and 28 through the use of an expandable metal 20. A lift rod 25 mounted on a clamp bridge is moved upward by the expansion of the expandable metal to lift the fixed first substrate 16. A lift bridge 17 coupled to the clamp bridge is moved downward and is kept, in contact with the second substrate 28 connected to the first substrate.