| 摘要 |
<p>PROBLEM TO BE SOLVED: To permit a wafer fixing method in which a wafer is hard to be bent by a foreign matter and local focus position deviations are hard to occur, by a method wherein only a marginal part of a wafer is brought into contact with an light exposing pedestal of a light exposing device and the marginal part of the wafer is fixed to the light exposing pedestal. SOLUTION: A light exposing pedestal 1 is a circular pedestal having the substantially same plane shape as a wafer W, and a marginal part of the light exposing pedestal 1 is a standing member of a height about several mm to form a ring type chuck 2. A plurality of attracting holes 2a for attracting and holding the wafer W are punched ranging over the entire periphery at an upper end of the ring type chuck 2 when the wafer W is brought into contact therewith. A first pump 21 is operated by a controller 23, and the wafer W is attracted by an attraction hole 2a, whereby the wafer W is fixed onto the light exposing pedestal 1. As a result, only the marginal part of the wafer W comes into contact with the ring type chuck 2 of the light exposing pedestal 1, and the other portion is held into non-contact with the light exposing pedestal l.</p> |
