METHOD FOR REWORKING WAFER FOR PRODUCING SEMICONDUCTOR DEVICE AND PRODUCTION OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To easily remove the whole of an abnormally applied photoresist with a thinner compsn. which is nontoxic to the human body while ensuring a proper dissolution rate, suitable volatility and viscosity. SOLUTION: In order to form a specified pattern on a semiconductor substrate, a photoresist is applied on the substrate and photographically etched (S12). When a defect is caused in the photographic etching process, the photoresist applied on the semiconductor substrate is removed (S16) with a thinner compsn. prepd. by mixing 70-80 wt.% ethyl-3-ethoxy propionate(EEP) with 17-23 wt.% ethyl lactate(EL) and 3-7 wt.%γ-butyrolactone(GBL).