| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for separating chips from semiconductor wafer by which chips can be separated from a semiconductor wafer, without crushing diaphragms or beams. SOLUTION: A chip 21 which forms the surface of a semiconductor wafer 22 is placed on the concave surface 17' of a pedestal 17, having the concave surface 17' and the semiconductor wafer 22, is pressed from the opposite surface of a wafer 33. Since the wafer 22 is pressed while a gap is formed between the wafer 22 and concave surface 17', the wafer 22 is not pressed against the concave surface 17' and chips can be separated from the wafer 22 without crushing diaphragms or beams.</p> |
