| 摘要 |
PROBLEM TO BE SOLVED: To raise luminance, to accelerate the heat radiation of a light emitting element and to maintain the light emission efficiency high, by using a light transmittable conductive adhesive material and recovering light from a light emission area as reflected light from a lead frame as well. SOLUTION: A device is provided with a lead frame 6 for loading a light emitting element 5 for which the semiconductor layer of junction is laminated on a transparent sapphire substrate 5a, and for being electrically conducted through an adhesive material 10. A layer facing the side of the lead frame 6 from the light emission area of the light emitting element 5 and the sapphire substrate 5a are made light transmissive and the adhesive material 10 is turned to a light transmissive material provided with heat conductivity. Further, for the lead frame 6, at least a surface for loading the light emitting element 5 is made light reflectable. |
