| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable multilayered printed wiring board which can be manufactured easily and in which layers are surely connected to each other. SOLUTION: A multilayered printed wiring board is formed by laminating a first substrate composed of conductor foil, or an insulating substrate 11 laminating conductor foil 12 on at least one surface, and having conductive bumps 13 formed on the foil 12, and a second substrate 16 composed of a prepreg 14 which has through holes 15 formed through the prepreg 14 with a laser beam at the positions corresponding to the bumps 13, and press forming the laminated body. |
