| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed circuit board of a build-up system which forms via holes of high quality having no gouge or separation and is excellent in interlayer connection reliability. SOLUTION: In this manufacturing method of the multilayer printed circuit board, a photosensitive insulating resin layer is provided on an inner conductor formed in an insulating substrate and is exposed and developed via a phototool to form the via holes. Thereafter, the photosensitive insulating resin layer surface is subjected to circuit machining including plating to form a conductor wiring. At the time of developing, an aq. alkaline developer containing an organic solvent is used as a developer and an aq. soln. containing the organic solvent is used as a rinsing soln. after developing to manufacture the multilayer printed circuit board. As the developer, an aq. soln. containing diethylene glycol monobutyl ether and sodium borate is preferably used. Further as the rinsing soln., an aq. soln. containing diethylene glycol monobutyl ether is preferably used. |
