发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT
摘要 PROBLEM TO BE SOLVED: To obtain a photosensitive resin compsn. excellent in adhesion to copper and chemical resistance, ensuring low COD and low BOD at the time of treating waste water and having low flocculating property in a developing tank and to obtain a photosensitive element with a layer of the photosensitive resin compsn. SOLUTION: The photosensitive resin compsn. contains (A) a thermoplastic polymer obtd. by copolymerizing 15-35 wt.% 3-15C carboxyl group-contg. a,β-unsatd. monomer with 1-40 wt.% styrene monomer represented by the formula [where R<1> is H or 1-4C alkyl, X is halogen or 1-4C alkyl, (n) is an integer of 0-3, and in the case of n>=2, plural X's may be the same or different], 10-70 wt.% methacrylate having a 1-8C alkyl group and 0-40 wt.% acrylate having a 1-8C alkyl group, (B) a photopolymn. initiator and (C) a photopolymerizable compd. having a polymerizable ethylenic unsatd. group. The photosensitive resin compsn. is applied on a substrate and dried to form the objective photosensitive element.
申请公布号 JPH11109625(A) 申请公布日期 1999.04.23
申请号 JP19970267293 申请日期 1997.09.30
申请人 HITACHI CHEM CO LTD 发明人 ICHIKAWA TATSUYA;ENDO MASAKI;KUSHIDA MASATAKA;KAJIWARA TAKUYA;KAMAKURA YUICHI
分类号 G03F7/027;G03F7/033;H01L21/027;(IPC1-7):G03F7/033 主分类号 G03F7/027
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