| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive resin compsn. having high sensitivity, capable of obtaining a pattern with a high rate of a residual film and excellent in adhesion to a sealing resin by composing the risin of specified polyamide, a photosensitive diazoquinone compd. and a specified phenol compd. SOLUTION: A photosensitive resin comopsn. consists of 100 pts.wt. polyamide represented by formula I, 1-100 pts.wt. a photosensitive diazoquinone compd. and 1-30 pts.wt. a phenol compd. represented by formula II. In the formula I, X is a tetravalent cyclic compd. group, Y is a divalent cyclic compd. group, Z is-R1 Si(R3 )(R4 )-O-Si(R3 )(R4 )-R2 - (each of R1 and R2 is a divalent org. group and each of R3 and R4 is a monovalent org. group) E is an alkenyl group or an aliphatic or a cyclic compd. group having the alkenyl group, each of a, b is a molar fraction, a+b=100 mol.%, (a) is 60.0-100.0 mol.%, (b) is 0-40.0 mol.% and (n) is 2-500. In the formula II, R5 and R6 are each an H atom or a alkyl group and R7 -R10 are each an H atom, a halogen atom, an alkyl group or the like. |
