| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency wiring board capable of reducing a manufacture cost and being applied to the respective kinds of product specifications. SOLUTION: For this high frequency wiring board, via hole conductor groups 14 and 17 for which many via hole conductors 13 and 16 are arranged with an interval less than 1/2 of a signal wavelength are arrayed for plural pieces inside a dielectric substrate where a conductor layer is formed, dielectric waveguide bodies 8 and 9 to be lines 15 and 18 for signal transmission between the adjacent via hole conductor groups 14 and 17 are piled up so as to almost orthogonally cross the directions of the lines 15 and 18 for the signal transmission between the adjacent dielectric waveguide bodies 8 and 9, and both lines 15 and 18 for the signal transmission are connected by power feeding bodies 20, 23 and 24 passed through a hole inside the conductor layer. |
