HOLDING DEVICE AND PROCESSING DEVICE MOUNTING THE SAME

摘要

PROBLEM TO BE SOLVED: To uncrack even at a high temperature and unremove an electrostatic chuck from a metallic heater due to a thermal distortion, by a method wherein a thermal expansion buffer layer having an intermediate thermal expansion coefficient between thermal expansion coefficients of the electrostatic chuck, and a heater is provided between the electrostatic chuck and the heater and jointed thereto. SOLUTION: A holding device comprises a metallic heater 3 in which a heating body 5 is buried, an electrostatic chuck 11 made of ceramics, and a thermal expansion buffer layer 6 joined and provided between the heater 3 and the electrostatic chuck 11. The thermal expansion buffer layer 6 has a thermal expansion coefficient between that of the electrostatic chuck 11 and that of the heater 3. Thus, a difference in the thermal expansion coefficients between the electrostatic chuck 11 and the heater 3 is scattered as a small difference in the thermal expansion coefficients between the electrostatic chuck 11 and the thermal expansion buffer layer 6 and a small difference in the thermal expansion coefficients between the heater 3 and the thermal expansion buffer layer 6, and a stress distortion due to a difference in the thermal expansion coefficients applied on the electrostatic chuck 11 is reduced.