| 摘要 |
PROBLEM TO BE SOLVED: To arrange signal lines at a high density on a multilayered wiring board, by uniformalizing the characteristic impedances of the signal lines even when a grid-like ground lines are arranged on the wiring board. SOLUTION: A multilayered wiring board is constituted by sequentially laminating an insulating layer 12 on which a signal line S1 is arranged in one direction of a grid, an insulating layer 13 on which a ground line G2 is arranged in the same grid-like state as that of a ground line G1 arranged on an insulating layer I1, an insulating layer 14 on which a signal line S2 is arranged in the other direction of the grid, and an insulating layer 15 on which a ground line G3 is arranged in the same grid-like state as that of the ground line G1 upon another on the insulating layer I1. The width of the signal line S1 is made narrower than those of the ground lines G1 and G2 and the width of the signal line S2 is made narrower than those of the ground lines G2 and G3. In addition, the signal lines S1 and S2 are connected to each other through a through conductor T which is passed through the insulating layers I3 and I4 and ground line 2 in a state where the conductor T is insulated from the line G2. |
