| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor resin sealed device in which the characteristics can be measured for a larger number of unit device elements. SOLUTION: The semiconductor resin sealed device comprises a power supply terminal 14 led out from a package, a GND terminal 15, a built-in element 11 to be measured, at least one switching transistor 16, and a signal switching circuit 12 connected with the switching transistor 16 to switch the switching transistor. The element 11 to be measured is connected in series with the switching transistor 16 and the series circuit is connected between the power supply terminal 14 and the GND terminal 15. Switching is made by connecting the output signal from the signal switching circuit 12 with the gate of the switching transistor 16. According to the circuitry, characteristics of the element 11 can be measured from the outside of the package by controlling the switching transistor 16. The element 11 to be measured includes a resistor element, a sampling transistor, or the like. |
