| 摘要 |
PROBLEM TO BE SOLVED: To obtain a positive photosensitive resin compsn. having high sensitiv ity to exposure with far UV, X-rays, electron beams, etc., and also having high resolution and to produce a resist image excellent in resolution. SOLUTION: The photosensitive resin compsn. contains (A) a resin soluble in an aq. alkali soln., (B) a compd. which generates an acid when irradiated with active chemical rays, (C) a material having an acid decomposable group and increasing solubility in the aq. alkali soln. by acid-catalytic reaction and (D) a propylene glycol monoalkyl ether propionate as a solvent. The photosensitive resin compsn. is applied on a substrate, dried, exposed, heated and developed to produce the objective resist image. |
