| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board by which corrosion on via conductors and cracks or ruptures on underfill caused by flux residues between an insulating substrate and a semiconductor device at the time of connection between electrodes of the semiconductor devices and the via conductors through solder bumps can be prevented effectively. SOLUTION: A wiring board is provided with an insulating substrate 1 and a via conductor 2, one end of which is protruded from the top of the insulating substrate 1 and is connected to an electrode of a semiconductor device 5 via a bump 6. In this case, at least the protruding end of the via conductor 2 is covered with a plating metal layer 7, and the height of the surface of the plating metal layer 7 from the top of the insulating substrate 1 is 10-50μm. Since a large amount of clearance is created between the top of the insulating substrate 1 and the semiconductor device 5, flux residue does not remain. |
