| 摘要 |
PROBLEM TO BE SOLVED: To mount a semiconductor chip which is relatively large in area with respect to the package size. SOLUTION: The respective rear surface of the first and second lead frames 15 being made into circuits in advance are stuck to the top and bottom sides of a nonconductive tape 11, and further semiconductor chips 14a and 14b are mounted severally the first and second lead frames 15, and then these are encapsulated with resin to make it into a package. Hereby, the lead frame face for mounting the semiconductor chip becomes at least two times as large as the conventional one, keeping the size of the package made of molded resin small, so that it becomes possible to easily mount a semiconductor chip of relatively large area. |
