| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a low-cost and high-reliability semiconductor device. SOLUTION: A semiconductor device is formed by mounting a semiconductor chip 1b on the surface of substrate 2b, on which electrode pads 3b are formed. In a method for manufacturing such a semiconductor device, the part of the substrate on which no electrode pad is formed is coated with thermosetting resin for a spacer in a form of dots. The semiconductor chip 1b is mounted on the substrate though the resin 6 for spacer and is heated to a temperature higher than the setting temperature of the resin 6 for the spacer. After the resin 6 for the spacer has been set, the clearance between the semiconductor chip and the substrate without resin 6 for spacer is filled with sealing resin 5, and the resin 5 is set. In this step for coating, the amount of resin for the spacer is set in such a way that the resin does not cover the electrode pads 3a of the substrate after the chip has been mounted.</p> |
