| 摘要 |
PROBLEM TO BE SOLVED: To enhance resistance against thermal stress at the time of mounting a semiconductor device on a circuit board having a recess by arranging a stress relaxing material for protecting the semiconductor device against thermal stress around the semiconductor device when the semiconductor device is mounted on the circuit board having a recess and resin sealed. SOLUTION: A metal layer 12 is formed on a recess made in a resin board 11 and die bonded with a light emitting element 13, e.g. a light emitting diode. Since a light emitting element is set in a recess, profile of a surface mounting device can be limited. The periphery of the light emitting element 13 is filled with a stress relaxing material 16a, e.g. translucent elastic silicone resin or other resins. It is then subjected to transfer molding of thermosetting translucent resin 17, e.g. translucent epoxy resin, from above the stress relaxing material 16a. A part of the translucent resin 17 is formed as a lens part 17a having function for condensing light emitted from the light emitting element 13 in a specified direction. |
