| 摘要 |
PROBLEM TO BE SOLVED: To make an electrical connection by directly forming bumps without the use of a barrier metal or by forming a barrier metal through a simple process by setting the diameter of conductive particles within a specified range with respect to the thickness of a connected section of an interconnecting layer on which the conductive particles have been deposited. SOLUTION: A projection electrode formed body is made by depositing fine conductive particles 4, whose diameter is half the thickness of connected sections 2 of an interconnecting layer or below on the connected sections 2 and them pressure molding them. In order to make an electrical connection between the conductive particles 4 and the connected sections 2, the conductive particles 4 are deposited on the connected sections 2 of an LSI chip or the like and then pressurizing them by a mold 5 or the like having projections at such sections, so, as to abut against the connected sections 2. The conductive particles 4 easily destroy, the surface oxide layers of the connected sections 2 and turn to possess strong adhesion with the connected sections 2. As a result, bumps can be formed in a bath at a wafer level directly on the connected sections or barrier metals can be collectly formed in a batch on the connected sections through an extremely simple process. |
