| 摘要 |
PROBLEM TO BE SOLVED: To allow the use of a thick bonding wire, even in a limited dimension by providing a plurality of bent parts. SOLUTION: A semiconductor chip 11 is attached tightly to an island 13, and a bonding pad 12 on the semiconductor chip 11 and a lead terminal 15 are wire-bonded with a bonding wire 16. The bonding wire 16 is provided with a first extending part 20 which rises vertically, a second extending part 21 which extends almost in horizontal direction, and a third extending part 22 which falls at an angle which is almost vertical, and a second bent part is allocated outside a chip end of the semiconductor chip 11. The diameter of the bonding wire 16 is 50-100 μm. |
