| 摘要 |
A stacked array embodiment (20) provides for efficient cooling of the diode bars (30, 30') and electrical connection between diode bars (30, 30') while maximizing alignment of the diode bars (30, 30'). The spacers (26, 27, 28) are connected to a conductive surface (34) on a heat spreader (24). In the stacked array, one or more diode bars (30, 30') are alternated in series with two or more conductive spacers (26, 27, 28), with a series circuit provided from diode bar (30'). Alternatively, thermally conductive separator fins (38, 38') situated between the spacers (26-28) to contact the diode bars (30, 30') situated between the spacers (26-28) to promote rapid heat transfer from the diodes while maintaining the diode bars (30, 30') electrically isolated from the conductive layer (34) on the substrate (24).
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