MULTILAYER PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD, AND RESIN COMPOSITION FOR FILLING THROUGH-HOLE

摘要

Over a board in which through-holes are formed, conductor circuits are formed on interlayer resin insulating layers. The through-holes have roughed inner walls and are filled with filling material. The parts where the filling material are exposed are covered with through-hole covering conductor layers. Further, via-holes formed directly above the through-hole covering conductor layers are connected to the conductor layers. The filling material is not separated from the through-holes, the connection reliability between the through-holes and the internal layer circuits is high and, further, high density wiring can be realized.