发明名称 |
Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate |
摘要 |
Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12 % by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration. <IMAGE> |
申请公布号 |
EP0875331(A3) |
申请公布日期 |
1999.04.21 |
申请号 |
EP19970116635 |
申请日期 |
1997.09.24 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TADAUCHI, MASAHIRO;TESHIMA, KOUICHI;KOMATSU, IZURU;NAKAMURA, SHINICHI;FURUYA, TOMIAKI;HATANAKA, TATSUYA;HAYASHI, MASARU;SUZUKI, ISAO;HIGASHINAKAGAWA, EMIKO;ARAI, SHINJI;YABUKI, MOTONAKA |
分类号 |
H05K1/02;B23K35/14;B23K35/26;H01L23/488;H05K1/11;H05K3/34 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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