发明名称 Semiconductor power module with connection pins
摘要 The semiconductor module has a housing with a housing wall (2) and a base (1) supporting a number of semiconductor elements (5). The housing wall has externally projecting terminal pins (9) provided by the upper part of a connection lead (7) which is coupled to the semiconductor element on the inside of the housing. The part of the connection lead on the inside of the housing has a rectangular cross-section, with a greater cross-sectional surface than the sum of the cross- sections of the terminal pins.
申请公布号 EP0750344(A3) 申请公布日期 1999.04.21
申请号 EP19960108534 申请日期 1996.05.29
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 MILLER, GERHARD, DR. ING.;FELDVOSS, MARIO, DIPL.- ING.
分类号 H01L23/48;H01L23/498;H01L25/07;H01L25/18 主分类号 H01L23/48
代理机构 代理人
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