发明名称 |
Semiconductor power module with connection pins |
摘要 |
The semiconductor module has a housing with a housing wall (2) and a base (1) supporting a number of semiconductor elements (5). The housing wall has externally projecting terminal pins (9) provided by the upper part of a connection lead (7) which is coupled to the semiconductor element on the inside of the housing. The part of the connection lead on the inside of the housing has a rectangular cross-section, with a greater cross-sectional surface than the sum of the cross- sections of the terminal pins. |
申请公布号 |
EP0750344(A3) |
申请公布日期 |
1999.04.21 |
申请号 |
EP19960108534 |
申请日期 |
1996.05.29 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
MILLER, GERHARD, DR. ING.;FELDVOSS, MARIO, DIPL.- ING. |
分类号 |
H01L23/48;H01L23/498;H01L25/07;H01L25/18 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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