发明名称 Method of fabricating a curved metal-ceramic-substrate
摘要 Production of a curved metallised ceramic substrate (1) for electrical or electronic components or circuits involves placing a green sheet (2) on the dished top surface of a mould element, e.g. a mould plate of heat resistant material, and then heat treating at ≥ 1200 degrees C for a predetermined time. Preferably, one or more green sheets are placed on a concave curved surface of the mould element, a weight (a heavy plate or a counter-mould element) is placed on the sheet or sheet stack and heat treatment is carried out in two successive steps, the second step being carried out at a lower (e.g. 100 degrees C lower) temperature than that of the first step. The metallisation (3, 4) is preferably applied onto the curved ceramic sheet (2) by direct copper bonding (DCB) of a copper foil or by bonding a metal foil using an active solder paste (e.g. of 40% Ag, 55% Cu and 5% Ti) or a solder foil (preferably a thin oxidised copper foil).
申请公布号 EP0872882(A3) 申请公布日期 1999.04.21
申请号 EP19980105261 申请日期 1998.03.24
申请人 CURAMIK ELECTRONICS GMBH 发明人 SCHULZ-HARDER, JUERGEN, DR.;EXEL, KARL, DR.
分类号 H01L21/48;H01L23/13;H01L23/373;H05K1/03;H05K3/00 主分类号 H01L21/48
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