METHOD FOR OBTAINING CORRECTING INFORMATION IN LASER BEAM MACHINING AND METHOD FOR CORRECTING LASER IRRADIATING POSITION

摘要

PROBLEM TO BE SOLVED: To correctly and efficiently measure a hole opened in a testing substrate at the time of obtaining corrected information on a laser irradiating position. SOLUTION: In a method for successively measuring a position of a testing hole H machined by being irradiated with a laser beam and obtaining a deviation between a measuring position P and a setting position (p) as correcting information, a process which predicts the measuring position P of the testing hole H next measured based on a vector V reaching from the measuring position P of the testing hole H first measured to the measuring position P of the testing hole H later measured in a pair of adjacent testing holes H already measured and the measuring position P of the testing hole H measured just before, and a process which arranges a measuring zone 1 by a position measuring means in a zone including the predicted measuring position P and measures the position of the testing hole H next measured are included in the measuring process of the testing hole H.