发明名称 LASER BEAM MACHINING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To enable further fine boring work and to make an apparatus itself compact by arranging a wave length converting element for converting the wave length of laser beam taken out from a Q switch into a specific short wave length and a condensing optical system. SOLUTION: The laser beam 9 emitted from a Q switch pulse SO2 laser beam oscillator is made incident on the wave length converting element 11 composed of e.g. AgGaSe2 and the wave length is converted in this inner part and becomes 1/2 of the original pulse beam. The laser beam 12 transmitting the wave length converting element 11 becomes a mixed beam of the laser beam converting the wave length and the original laser beam reserved with no conversion because the converting efficiency of the element is not 100%. At the time of making the laser beam 12 incident on a beam splitter 13 composed of e.g. MgF2 , the beam converting the wave length is reflected and the reversed beam with no conversion is transmitted. Only the beam 12 converting the wave length is introduced to the condensing optical system 15 through a transmitting optical path system 14 and condensed to a material 16 to be machined.</p>
申请公布号 JPH11104870(A) 申请公布日期 1999.04.20
申请号 JP19970272962 申请日期 1997.10.06
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKENAKA YUJI;NISHIMAE JUNICHI;TANAKA MASAAKI
分类号 B23K26/00;B23K26/06;B23K26/38;H01S3/11;H05K3/00;(IPC1-7):B23K26/00 主分类号 B23K26/00
代理机构 代理人
主权项
地址