发明名称 |
Jet soldering system and method |
摘要 |
An apparatus for depositing a selected pattern of solder onto a substrate comprising: a substrate support having structure for bearing a substrate on which one or more electronic components are to be mounted; a solder ejector that defines a cavity for containing molten solder and an orifice for ejecting a stream of molten solder; a heater for heating the solder to a temperature above the melting point of solder; a vibrator coupled to the solder ejector to form droplets in the stream at the desired frequency for deposition onto the substrate; and a cooler, adapted to receive a coolant, disposed between the heater and the vibrator to maintain the temperature of the vibrator below that which would detrimentally affect the performance of the vibrator.
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申请公布号 |
US5894980(A) |
申请公布日期 |
1999.04.20 |
申请号 |
US19960718607 |
申请日期 |
1996.09.23 |
申请人 |
RAPID ANALYSIS DEVELOPMENT COMAPNY |
发明人 |
ORME-MARMARELIS, MELISSA E.;MUNTZ, ERIC PHILLIP |
分类号 |
B23K3/06;(IPC1-7):B23K3/06;B23K37/06 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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