ADHESIVE FOR ELECTROLESS PLATING AND PRINTED CIRCUIT BOARD USING THAT,申请号JP19970284646-传众专利搜索

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发明名称	ADHESIVE FOR ELECTROLESS PLATING AND PRINTED CIRCUIT BOARD USING THAT
摘要
申请公布号	JPH11106936(A)	申请公布日期	1999.04.20
申请号	JP19970284646	申请日期	1997.09.30
申请人	IBIDEN CO LTD	发明人	GOTO AKIHIKO
分类号	C09J163/00;C23C18/31;C23C18/32;H05K3/18;(IPC1-7):C23C18/31	主分类号	C09J163/00
代理机构		代理人
主权项
地址

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