| 摘要 |
PROBLEM TO BE SOLVED: To facilitate a peeling operation of a separator after temporary connection by giving a smaller adhesiveness to the separator side of a heat-adherent film adhesive for circuit connection, which is supported by the separator on one side and has a different adhesive strength on each side, than to the other side. SOLUTION: A film adhesive for circuit connection is used to connect electrodes in the pressing direction electrically by heating and pressing two circuit electrodes facing each other. As the adhesive, an epoxy resin, an acrylic rubber and a potential curing agent (e.g. micro capsule type) are blended. As the acrylic rubber, the one containing glycidyl ether groups in the molecule is preferable. The elastic modulus of a resin constituting one side of the adhesive composition is preferably 100-2,000 MPa at 40 deg.C after cured. 0.1-20 parts by volume of conductive particles (e.g. gold particles having diameters of 1-10μm) can be dispersed.
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